
Proceedings Paper
SOI photonic technology for defense and securityFormat | Member Price | Non-Member Price |
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Paper Abstract
APIC (Advanced Photonics Integrated Circuits) Corporation is engaged in the research,
development, and production of highly integrated photonic (HIP) and highly integrated photonic and
electronic (HIPE) chip technology for a variety of defense and homeland security applications. This
technology allows for significantly reduced chip size while also eliminating numerous pigtails and
interconnects, thereby improving system reliability while reducing cost. APIC's Mid-Pacific Photonics
Prototyping Facility (M3PF) is a Navy-funded 6" and 8" silicon-on-insulator (SOI) photonic prototyping
facility that was constructed specifically to meet this need. Among other high-tech equipment, M3PF is
equipped with a high-resolution ASML QML stepper, a lithography tool that is capable of achieving 0.25-
μm resolution with a field size of 22 mm by 32.5 mm. APIC is developing processing techniques for fiber-compatible
core-size waveguides as well as for complementary metal-oxide semiconductor (CMOS)-
compatible core-size waveguides. In this paper, APIC's SOI photonic technology and M3PF capabilities
will be described in detail. In addition, processed chips and their performance and applications will be
discussed to demonstrate the efficacy of M3PF. APIC's additional processing capabilities--such as wafer
bonding for heterogeneous integration processing, which plays a key role in HIPE chip implementation--
will be described as well.
Paper Details
Date Published: 12 May 2006
PDF: 8 pages
Proc. SPIE 6243, Enabling Photonics Technologies for Defense, Security, and Aerospace Applications II, 624302 (12 May 2006); doi: 10.1117/12.673574
Published in SPIE Proceedings Vol. 6243:
Enabling Photonics Technologies for Defense, Security, and Aerospace Applications II
Michael J. Hayduk; Andrew R. Pirich; Eric J. Donkor; Peter J. Delfyett Jr., Editor(s)
PDF: 8 pages
Proc. SPIE 6243, Enabling Photonics Technologies for Defense, Security, and Aerospace Applications II, 624302 (12 May 2006); doi: 10.1117/12.673574
Show Author Affiliations
James Chan, APIC Corp. (United States)
Raj Dutt, APIC Corp. (United States)
Published in SPIE Proceedings Vol. 6243:
Enabling Photonics Technologies for Defense, Security, and Aerospace Applications II
Michael J. Hayduk; Andrew R. Pirich; Eric J. Donkor; Peter J. Delfyett Jr., Editor(s)
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