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Proceedings Paper

The path to adaptive microsystems
Author(s): John C. Zolper; Michael J. Biercuk
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Paper Abstract

Scaling trends in microsystems are discussed frequently in the technical community, providing a short-term perspective on the future of integrated microsystems. This paper looks beyond the leading edge of technological development, focusing on new microsystem design paradigms that move far beyond today's systems based on static components. We introduce the concept of Adaptive Microsystems and outline a path to realizing these systems-on-a-chip. The role of DARPA in advancing future components and systems research is discussed, and specific DARPA efforts enabling and producing adaptive microsystems are presented. In particular, we discuss efforts underway in the DARPA Microsystems Technology Office (MTO) including programs in novel circuit architectures (3DIC), adaptive imaging and sensing (AFPA, VISA, MONTAGE, A-to-I) and reconfigurable RF/Microwave devices (SMART, TFAST, IRFFE).

Paper Details

Date Published: 18 May 2006
PDF: 14 pages
Proc. SPIE 6232, Intelligent Integrated Microsystems, 623201 (18 May 2006); doi: 10.1117/12.669715
Show Author Affiliations
John C. Zolper, DARPA Microsystems Technology Office (United States)
Michael J. Biercuk, DARPA Microsystems Technology Office (United States)
Booz Allen Hamilton (United States)

Published in SPIE Proceedings Vol. 6232:
Intelligent Integrated Microsystems
Ravindra A. Athale; John C. Zolper, Editor(s)

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