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Proceedings Paper

Surface/subsurface observation and removal mechanisms of ground reaction bonded silicon carbide
Author(s): Wang Yao; Yu-Min Zhang; Jie-cai Han; Yun-long Zhang; Jian-han Zhang; Yu-feng Zhou; Yuan-yuan Han
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Paper Abstract

Reaction Bonded Silicon Carbide (RBSiC) has long been recognized as a promising material for optical applications because of its unique combination of favorable properties and low-cost fabrication. Grinding of silicon carbide is difficult because of its high hardness and brittleness. Grinding often induces surface and subsurface damage, residual stress and other types of damage, which have great influence on the ceramic components for optical application. In this paper, surface integrity, subsurface damage and material removal mechanisms of RBSiC ground using diamond grinding wheel on creep-feed surface grinding machine are investigated. The surface and subsurface are studied with scanning electron microscopy (SEM) and optical microscopy. The effects of grinding conditions on surface and subsurface damage are discussed. This research links the surface roughness, surface and subsurface cracks to grinding parameters and provides valuable insights into the material removal mechanism and the dependence of grind induced damage on grinding conditions.

Paper Details

Date Published: 1 February 2006
PDF: 8 pages
Proc. SPIE 6034, ICO20: Optical Design and Fabrication, 60340H (1 February 2006); doi: 10.1117/12.668101
Show Author Affiliations
Wang Yao, Harbin Institute of Technology (China)
Yu-Min Zhang, Harbin Institute of Technology (China)
Jie-cai Han, Harbin Institute of Technology (China)
Yun-long Zhang, Harbin Institute of Technology (China)
Jian-han Zhang, Harbin Institute of Technology (China)
Yu-feng Zhou, Harbin Institute of Technology (China)
Yuan-yuan Han, Harbin Institute of Technology (China)

Published in SPIE Proceedings Vol. 6034:
ICO20: Optical Design and Fabrication
James Breckinridge; Yongtian Wang, Editor(s)

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