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Proceedings Paper

Process simulation of Kovar-glass-silicon bonding for micromachined combustor
Author(s): Ying Zhao; Min Miao; Yufeng Jin; Xue Chuan Shan; Chee Khuen Wong
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Paper Abstract

High-temperature and high-pressure connection between micro combustor and macro world for feeding of air/fuel gas is required in PowerMEMS development. A Kovar tubing-Glass-Si sealing process has been developed for an on-going PowerMEMS project to connect Kovar tubes with diameters of 2mm and 4mm, to top Si wafer of micro combustor fabricated by DRIE process. Due to the different CTEs (coefficients of thermal expansion) of the connected materials, thermal stress around the sealing area could probably influence the obturation and other properties of the sealed combustor. A numeric simulation on sealing of the structure was conducted on ANSYS software to investigate this kind of sealing process. The thermal stress and displacement from room temperature to combustion circumstance, and to sealing condition as high as 1220K were simulated. The size affection of glass bonder and the metal tubes was investigated. A process of high temperature sealing Kovar-glass-silicon was developed and a prototype of the packaged micro combustor was manufactured.

Paper Details

Date Published: 7 February 2006
PDF: 9 pages
Proc. SPIE 6032, ICO20: MEMS, MOEMS, and NEMS, 60320C (7 February 2006); doi: 10.1117/12.667859
Show Author Affiliations
Ying Zhao, Peking Univ. (China)
Min Miao, Peking Univ. (China)
Yufeng Jin, Peking Univ. (China)
Xue Chuan Shan, Singapore Institute of Manufacturing Technology (Singapore)
Chee Khuen Wong, Singapore Institute of Manufacturing Technology (Singapore)

Published in SPIE Proceedings Vol. 6032:
Masayoshi Esashi; Zhaoying Zhou, Editor(s)

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