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Proceedings Paper

3D system architectures
Author(s): Jonathan M. Stern; Volkan H. Ozguz
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Paper Abstract

The ever increasing demand for more electronic functionality integrated in silicon chips requires new approaches. One solution is to explore several technology fronts such as nanometer lithography or advanced materials. A better (but complementary) solution is to use the third dimension by stacking multiple layers of integrated circuits that overcomes the limitations of planar approaches. A general overview of 3D packaging and integration approaches is presented in relation to system architectures that will benefit from 3D implementation.

Paper Details

Date Published: 18 May 2006
PDF: 12 pages
Proc. SPIE 6232, Intelligent Integrated Microsystems, 62320K (18 May 2006); doi: 10.1117/12.667381
Show Author Affiliations
Jonathan M. Stern, Irvine Sensors Corp. (United States)
Volkan H. Ozguz, Irvine Sensors Corp. (United States)

Published in SPIE Proceedings Vol. 6232:
Intelligent Integrated Microsystems
Ravindra A. Athale; John C. Zolper, Editor(s)

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