
Proceedings Paper
Development of a technology for fabricating low-cost parallel optical interconnectsFormat | Member Price | Non-Member Price |
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Paper Abstract
We present a fabrication technology for integrating polymer waveguides and 45° micromirror couplers into standard
electrical printed circuit boards (PCBs). The most critical point that is being addressed is the low-cost manufacturing
and the compatibility with current PCB production. The latter refers to the processes as well as material compatibility.
In the fist part the waveguide fabrication technology is discussed, both photo lithography and laser ablation are
proposed. It is shown that a frequency tripled Nd-YAG laser (355 nm) offers a lot of potential for defining single mode
interconnections. Emphasis is on multimode waveguides, defined by KrF excimer laser (248 nm) ablation using acrylate
polymers. The first conclusion out of loss spectrum measurements is a 'yellowing effect' of laser ablated waveguides,
leading to an increased loss at shorter wavelengths. The second important conclusion is a potential low loss at a
wavelength of 850 nm, 980 nm and 1310 nm. This is verified at 850 nm by cut-back measurements on 10-cm-long
waveguides showing an average propagation loss of 0.13 dB/cm. Photo lithographically defined waveguides using
inorganic-organic hybrid polymers show an attenuation loss of 0.15 dB/cm at 850 nm. The generation of debris and the
presence of microstructures are two main concerns for KrF excimer laser ablation of hybrid polymers.
In the second part a process for embedding metal coated 45° micromirrors in optical waveguiding layers is described.
Mirrors are selectively metallized using a lift-off process. Filling up the angled via without the presence of air bubbles
and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with
ultrasound agitation. Initial loss measurements indicate an excess mirror loss of 1.5 dB.
Paper Details
Date Published: 21 April 2006
PDF: 8 pages
Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 618507 (21 April 2006); doi: 10.1117/12.663499
Published in SPIE Proceedings Vol. 6185:
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Hugo Thienpont; Mohammad R. Taghizadeh; Peter Van Daele; Jürgen Mohr, Editor(s)
PDF: 8 pages
Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 618507 (21 April 2006); doi: 10.1117/12.663499
Show Author Affiliations
Geert Van Steenberge, Ghent Univ. (Belgium)
Nina Hendrickx, Ghent Univ. (Belgium)
Peter Geerinck, Ghent Univ. (Belgium)
Nina Hendrickx, Ghent Univ. (Belgium)
Peter Geerinck, Ghent Univ. (Belgium)
Erwin Bosman, Ghent Univ. (Belgium)
Steven Van Put, Ghent Univ. (Belgium)
Peter Van Daele, Ghent Univ. (Belgium)
Steven Van Put, Ghent Univ. (Belgium)
Peter Van Daele, Ghent Univ. (Belgium)
Published in SPIE Proceedings Vol. 6185:
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Hugo Thienpont; Mohammad R. Taghizadeh; Peter Van Daele; Jürgen Mohr, Editor(s)
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