Proceedings Paper
Light propagation in a GRIN microlens with gain or loss and comparison with lossless case| Format | Member Price | Non-Member Price |
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Paper Abstract
The correspondence between the linear integral transform and the ray-transfer matrix of a diffraction-free first-order optical system is used to describe the ray trajectory and to study the point spread function (PSF) in an active GRIN microlens characterized by a complex refractive index. The results show that the active microlens is regarded as a lossless microlens with a Gaussian mask induced by the complex refractive index. Comparison between light propagation effects in passive and active GRIN microlens is outlined.
Paper Details
Date Published: 21 April 2006
PDF: 8 pages
Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 618515 (21 April 2006); doi: 10.1117/12.661993
Published in SPIE Proceedings Vol. 6185:
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Hugo Thienpont; Mohammad R. Taghizadeh; Peter Van Daele; Jürgen Mohr, Editor(s)
PDF: 8 pages
Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 618515 (21 April 2006); doi: 10.1117/12.661993
Show Author Affiliations
C. Gomez-Reino, Univ. de Santiago de Compostela (Spain)
M. T. Flores-Arias, Univ. de Santiago de Compostela (Spain)
A. Castelo, Univ. de Santiago de Compostela (Spain)
Y. Meuret, Free Univ. of Brussels (Belgium)
M. T. Flores-Arias, Univ. de Santiago de Compostela (Spain)
A. Castelo, Univ. de Santiago de Compostela (Spain)
Y. Meuret, Free Univ. of Brussels (Belgium)
C. Ruwisch, Free Univ. of Brussels (Belgium)
H. Thienpont, Free Univ. of Brussels (Belgium)
N. Lindelein, Friedrich-Alexander-Univ. of Erlangen-Nuremberg (Germany)
H. Thienpont, Free Univ. of Brussels (Belgium)
N. Lindelein, Friedrich-Alexander-Univ. of Erlangen-Nuremberg (Germany)
Published in SPIE Proceedings Vol. 6185:
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Hugo Thienpont; Mohammad R. Taghizadeh; Peter Van Daele; Jürgen Mohr, Editor(s)
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