
Proceedings Paper
Design, fabrication, and replication of micro-optical components for educational purposes within the network of excellence in micro-optics (NEMO)Format | Member Price | Non-Member Price |
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$17.00 | $21.00 |
Paper Abstract
The design and fabrication of a demonstration kit (EduKit) for secondary school students is described. We
present the final iteration of the layout of the EduKit and outline some of the simple experiments which the kit
is intended to show. The mass replication techniques used in the production of this project are described and
the final educational outcomes of the project are discussed.
Paper Details
Date Published: 21 April 2006
PDF: 8 pages
Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 61850B (21 April 2006); doi: 10.1117/12.661912
Published in SPIE Proceedings Vol. 6185:
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Hugo Thienpont; Mohammad R. Taghizadeh; Peter Van Daele; Jürgen Mohr, Editor(s)
PDF: 8 pages
Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 61850B (21 April 2006); doi: 10.1117/12.661912
Show Author Affiliations
A. J. Waddie, Heriot-Watt Univ. (United Kingdom)
M. R. Taghizadeh, Heriot-Watt Univ. (United Kingdom)
J. Mohr, Forschungszentrum Karlsruhe (Germany)
V. Piotter, Forschungszentrum Karlsruhe (Germany)
M. R. Taghizadeh, Heriot-Watt Univ. (United Kingdom)
J. Mohr, Forschungszentrum Karlsruhe (Germany)
V. Piotter, Forschungszentrum Karlsruhe (Germany)
Ch. Mehne, Forschungszentrum Karlsruhe (Germany)
A. Stuck, Ctr. Suisse d’Electronique et de Microtechnique SA (Switzerland)
E. Stijns, Vrije Univ. Brussel (Belgium)
H. Thienpont, Vrije Univ. Brussel (Belgium)
A. Stuck, Ctr. Suisse d’Electronique et de Microtechnique SA (Switzerland)
E. Stijns, Vrije Univ. Brussel (Belgium)
H. Thienpont, Vrije Univ. Brussel (Belgium)
Published in SPIE Proceedings Vol. 6185:
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Hugo Thienpont; Mohammad R. Taghizadeh; Peter Van Daele; Jürgen Mohr, Editor(s)
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