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Proceedings Paper

Thermal stress kinetics in the microresist–silicon system
Author(s): S. Tamulevicius; V. Grigaliunas; D. Jucius; V. Ostasevicius; A. Palevicius; G. Janusas
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Paper Abstract

In this work we report stress kinetics of thermoplastic polymer mr-I 8020 on crystalline silicon during thermal exposure to the temperature ranges typically applied in the imprint experiment. Stress kinetics in the polymer-silicon structure was measured experimentally in-situ using a Michelson interferometer and controlling temperature of the structure by thermocouple. The changes of radius of curvature due to the thermal heating were measured by laser (λ=633nm) interferometer and corresponding stress was calculated using a Stoney formula. It is shown that within the temperatures below the polymer glassing temperatures elastic response of the polymer dominates for different time of heating and cooling.

Paper Details

Date Published: 24 March 2006
PDF: 6 pages
Proc. SPIE 6151, Emerging Lithographic Technologies X, 61512I (24 March 2006); doi: 10.1117/12.659952
Show Author Affiliations
S. Tamulevicius, Kaunas Univ. of Technology (Lithuania)
V. Grigaliunas, Kaunas Univ. of Technology (Lithuania)
D. Jucius, Kaunas Univ. of Technology (Lithuania)
V. Ostasevicius, Kaunas Univ. of Technology (Lithuania)
A. Palevicius, Kaunas Univ. of Technology (Lithuania)
G. Janusas, Kaunas Univ. of Technology (Lithuania)

Published in SPIE Proceedings Vol. 6151:
Emerging Lithographic Technologies X
Michael J. Lercel, Editor(s)

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