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Proceedings Paper

Low-voltage single crystal actuators
Author(s): Xiaoning Jiang; Paul W. Rehrig; Jun Luo; Wesley S. Hackenberger; Shujun Zhang; Thomas R. Shrout
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Paper Abstract

In this paper low voltage single crystal actuators were investigated using thin PMN-PT plates for applications requiring low voltage, large strain, low profile and/or actuation at cryogenic temperatures. Firstly, single crystal thickness effect on piezoelectric properties was studied by investigating the relationship between electromechanical coupling coefficient of PMN-PT crystals and the crystal thickness. It was found that electromechanical coupling coefficient (kt) of 50 μm, 75 μm and 100 μm PMN-PT single crystal thin plates are 0.5, 0.51, and 0.55, respectively, which are slightly lower than that of bulk single crystal (0.6). A couple of single crystal actuators were then assembled using crystal plates with thickness of 150-200 μm. These actuators were characterized by measuring strain vs. electric field at room temperature and cryogenic temperatures. A 3 mm x 3 mm x 19 mm single crystal stack actuator showed a 21 μm stroke at room temperature under 150 V, and a 10 μm stroke at 60 K under 200 V. A 5 mm x 5 mm x 12 mm single crystal actuator showed 13.5 μm stroke at room temperature under 150 V, and 6 μm stroke at 77 K under 150 V. These low voltage actuators hold promising for space precise positioning and adaptive structures and cryogenic SEM, SPM and STM applications.

Paper Details

Date Published: 6 April 2006
PDF: 8 pages
Proc. SPIE 6170, Smart Structures and Materials 2006: Active Materials: Behavior and Mechanics, 61700G (6 April 2006); doi: 10.1117/12.659621
Show Author Affiliations
Xiaoning Jiang, TRS Technologies, Inc. (United States)
Paul W. Rehrig, TRS Technologies, Inc. (United States)
Jun Luo, TRS Technologies, Inc. (United States)
Wesley S. Hackenberger, TRS Technologies, Inc. (United States)
Shujun Zhang, The Pennsylvania State Univ. (United States)
Thomas R. Shrout, The Pennsylvania State Univ. (United States)

Published in SPIE Proceedings Vol. 6170:
Smart Structures and Materials 2006: Active Materials: Behavior and Mechanics
William D. Armstrong, Editor(s)

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