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Proceedings Paper

Design and development of microstrip patch antenna at Ka-band using MEMS technology
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Paper Abstract

This paper reports a Ka-band microstrip patch antenna fabricated using post-CMOS compatible process technology. The antenna uses an air cavity underneath the patch radiator that is supported on thin membrane. To start with, a thin dielectric film of silicon dioxide is deposited on <100> single crystal silicon substrates by RF sputtering process. The membrane is then realized using bulk micromachining technology. The antenna structure was analyzed and optimized using the finite-element method (FEM) based Ansoft High Frequency Structure Simulator software (version 9). The antenna structure mounted on a test jig with K-connector was used for testing its performance. The measured results of the fabricated prototype antenna agree quite closely with the simulated results. The fabricated antenna resonated at 36 GHz with -10 dB return loss bandwidth of 1.2 GHz. In the absence of access to well-established MEMS foundry, the RF sputtering process reported here can be advantageously used for rapid prototyping of many antenna structures.

Paper Details

Date Published: 31 March 2006
PDF: 10 pages
Proc. SPIE 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, 61721F (31 March 2006); doi: 10.1117/12.659030
Show Author Affiliations
Preeti Sharma, Indian Institute of Technology, Delhi (India)
Shiban K. Koul, Indian Institute of Technology, Delhi (India)
Sudhir Chandra, Indian Institute of Technology, Delhi (India)

Published in SPIE Proceedings Vol. 6172:
Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology
Vijay K. Varadan, Editor(s)

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