
Proceedings Paper
Developing thermal energy computing tools for sonic infrared imagingFormat | Member Price | Non-Member Price |
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Paper Abstract
Sonic IR Imaging is a novel NDE technique, which combines a short ultrasonic pulse excitation and infrared imaging to detect defects in materials and structures. The ultrasound pulse, typically a fraction of a second long, causes heating in the defects, which results in the change of IR radiation from the target. This change can be detected by infrared sensors, and thus, defects can be identified. One key objective in developing this technology is to maximize the IR signal so that the probability of detection (POD) of defects is optimized. From our work, we learned that the ultrasonic frequency, coupling medium between the ultrasonic transducer and the target, the pressure from the transducer on the target, the characteristics of the target itself, etc. are all factors that affect the IR signals. In addition, different IR sensors have different responses for the same IR radiation. To develop Sonic IR Imaging technology, it is important to study the relationship between the IR signal and the input acoustic energy for different system configurations. In this paper, we'll describe the thermal energy computing tools developed for analyzing data from different sets of parameters in Sonic IR Imaging.
Paper Details
Date Published: 11 April 2006
PDF: 7 pages
Proc. SPIE 6174, Smart Structures and Materials 2006: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, 617432 (11 April 2006); doi: 10.1117/12.658799
Published in SPIE Proceedings Vol. 6174:
Smart Structures and Materials 2006: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems
Masayoshi Tomizuka; Chung-Bang Yun; Victor Giurgiutiu, Editor(s)
PDF: 7 pages
Proc. SPIE 6174, Smart Structures and Materials 2006: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, 617432 (11 April 2006); doi: 10.1117/12.658799
Show Author Affiliations
Xiaoyan Han, Wayne State Univ. (United States)
Qi He, Wayne State Univ. (United States)
Published in SPIE Proceedings Vol. 6174:
Smart Structures and Materials 2006: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems
Masayoshi Tomizuka; Chung-Bang Yun; Victor Giurgiutiu, Editor(s)
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