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Proceedings Paper

Extending i-line capabilities through variance characterization and tool enhancement
Author(s): Dan Miller; Adrian Salinas; Joel Peterson; David Vickers; Dan Williams
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Paper Abstract

Continuous economic pressures have moved a large percent of integrated device manufacturing (IDM) operations either overseas or to foundry operations over the last 10 years. These pressures have left the IDM fabs in the U.S. with required COO improvements in order to maintain operations domestically. While the assets of many of these factories are at a very favorable point in the depreciation life cycle, the equipment and processes are constrained to the quality of the equipment in its original state and the degradation over its installed life. With the objective to enhance output and improve process performance, this factory and their primary lithography process tool supplier have been able to extend the usable life of the existing process tools, increase the output of the tool base, and improve the distribution of the CDs on the product produced. Texas Instruments Incorporated lead an investigation with the POLARIS® Systems & Services business of FSI International to determine the sources of variance in the i-line processing of a wide array of IC device types. Data from the sources of variance were investigated such as PEB temp, PEB delay time, develop recipe, develop time, and develop programming. While PEB processes are a primary driver of acid catalyzed resists, the develop mode is shown in this work to have an overwhelming impact on the wafer to wafer and across wafer CD performance of these i-line processes. These changes have been able to improve the wafer to wafer CD distribution by more than 80 %, and the within wafer CD distribution by more than 50 % while enabling a greater than 50 % increase in lithography cluster throughput. The paper will discuss the contribution from each of the sources of variance and their importance in overall system performance.

Paper Details

Date Published: 29 March 2006
PDF: 13 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 615336 (29 March 2006); doi: 10.1117/12.656832
Show Author Affiliations
Dan Miller, FSI International (United States)
Adrian Salinas, Texas Instruments Inc. (United States)
Joel Peterson, Texas Instruments Inc. (United States)
David Vickers, FSI International (United States)
Dan Williams, Sumika Electronic Materials, Inc. (United States)

Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

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