
Proceedings Paper
Using reconfigurable OPC to improve quality and throughput of sub-100nm IC manufacturingFormat | Member Price | Non-Member Price |
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Paper Abstract
In this paper we propose an alternative sub-100nm manufacturing flow using reconfigurable OPC technology. In this flow, an initial full-chip OPC is performed similar to the conventional approach. But when errors are found during verification - which can include checks across the process window - we optimize the OPC results locally with reconfigurable OPC technology without disturbing the OPC results elsewhere in the design. Creating optimized local solutions for LRC errors offers a more manufacturable solution, and it virtually guarantees rapid and correct OPC convergence. These chip-specific solutions can then be retained for future runs and the results analyzed for inclusion in the global or "master" recipe.
Paper Details
Date Published: 20 March 2006
PDF: 8 pages
Proc. SPIE 6154, Optical Microlithography XIX, 61543D (20 March 2006); doi: 10.1117/12.656708
Published in SPIE Proceedings Vol. 6154:
Optical Microlithography XIX
Donis G. Flagello, Editor(s)
PDF: 8 pages
Proc. SPIE 6154, Optical Microlithography XIX, 61543D (20 March 2006); doi: 10.1117/12.656708
Show Author Affiliations
Richard D. Morse, Aprio Technologies (United States)
Pat LoPresti, Aprio Technologies (United States)
Pat LoPresti, Aprio Technologies (United States)
Kevin Corbett, Aprio Technologies (United States)
Published in SPIE Proceedings Vol. 6154:
Optical Microlithography XIX
Donis G. Flagello, Editor(s)
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