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Proceedings Paper

EUV pellicle development for mask defect control
Author(s): Yashesh A. Shroff; Michael Goldstein; Bryan Rice; Sang H. Lee; K. V. Ravi; Daniel Tanzil
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Paper Abstract

The absence of a reliable non-removable pellicle is a significant obstacle in the development of EUV lithography. In this paper we present analytical and experimental results of a pellicle concept. The concept is based on the development of an EUV transmissive film supported with a wire-mesh. The form factor of the proposed solution is not different from a standard pellicle application, thus this would not require dramatic tool design changes. Results from developmental studies of two materials, silicon (Si) and ruthenium (Ru), are presented. As expected, Si shows oxidation on both surfaces of the thin film, while the less transmissive Ru has excellent resistance to oxidation. Spectral analysis at EUV wavelengths of pellicle coupons agrees very well with the theoretical analysis.

Paper Details

Date Published: 22 March 2006
PDF: 10 pages
Proc. SPIE 6151, Emerging Lithographic Technologies X, 615104 (22 March 2006); doi: 10.1117/12.656551
Show Author Affiliations
Yashesh A. Shroff, Intel Corp. (United States)
Michael Goldstein, Intel Corp. (United States)
Bryan Rice, Intel Corp. (United States)
Sang H. Lee, Intel Corp. (United States)
K. V. Ravi, Intel Corp. (United States)
Daniel Tanzil, Intel Corp. (United States)

Published in SPIE Proceedings Vol. 6151:
Emerging Lithographic Technologies X
Michael J. Lercel, Editor(s)

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