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Proceedings Paper

An integrated approach to the determination of a manufacturable process window in advanced microlithography
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Paper Abstract

Resolution enhancement techniques (RET), immersion lithography, and Design for Manufacturing (DFM) are all geared towards increasing the lithographic process window to enable the ever more difficult processing demands of semiconductor manufacturing. It is well understood that there is a trade-off between depth of focus (DOF) and exposure dose latitude (EL), as well as best focus (BF) and best exposure dose (BE), in which a Manufacturable Process Window (MPW) must be established and centered. Oftentimes it is overlooked that this balance needs to be maintained across multiple dimensions including spatial (e.g. across field), density (e.g. dense, iso), temporal, tool-to-tool, etc. To maintain this critical balance, both test wafers and product wafers need to be monitored and analyzed in order to support Advanced Process Control (APC) and Automated Equipment Control (AEC). In this work we establish a method to optimize process window by using an integrated analysis workstation based on measurements from both optical and e-beam metrology. By applying this method, we demonstrate a MPW on daily FEM and nominal wafers already used at IMEC for daily process qualification.

Paper Details

Date Published: 24 March 2006
PDF: 8 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 615231 (24 March 2006); doi: 10.1117/12.656503
Show Author Affiliations
Marcelo Cusacovich, KLA-Tencor Corp. (United States)
John C. Robinson, KLA-Tencor Corp. (United States)
Shaunee Cheng, IMEC (Belgium)
Greet Storms, IMEC (Belgium)
Philippe Leray, IMEC (Belgium)
Gian F. Lorusso, IMEC (Belgium)

Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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