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Proceedings Paper

AIM technology for nonvolatile memories microelectronics devices
Author(s): Pier Luigi Rigolli; Laura Rozzoni; Catia Turco; Umberto Iessi; Marco Polli; Elyakim Kassel; Pavel Izikson; Yosef Avrahamov
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Paper Abstract

Accurate and precise overlay metrology is a critical requirement in order to achieve high product yield in microelectronic manufacturing. Meeting the tighter overlay measurement error requirements for 90nm technology and beyond is a dramatic challenge for optical metrology techniques using only conventional overlay marks like Bar in Bar (BiB) or Frame in Frames (FiF). New deficiencies, affecting traditional overlay marks, become evident as microlithography processes are developed for each new design rule node. The most serious problems are total measurement uncertainty, CMP process robustness, and device correlation. In this paper we will review the superior performances of grating-based AIM marks to provide a complete solution to control lithography overlay errors for new generation devices. Examples of successful application of AIM technology to FEOL and Cu-BEOL process steps of advanced non volatile memory devices manufacturing are illustrated. An additional advantage of the adoption of AIM marks is that the significant reduction of target noise versus conventional marks revealed systematic differences within the lithography cluster which were previously obscure offering a new tool to optimize litho cells. In this paper we demonstrated that AIM target architecture enables high performance metrology with design rule segmented targets - a prerequisite to have overlay marks fully compatible with design rule sensitive process steps.

Paper Details

Date Published: 24 March 2006
PDF: 13 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61524C (24 March 2006); doi: 10.1117/12.656485
Show Author Affiliations
Pier Luigi Rigolli, STMicroelectronics Srl (Italy)
Laura Rozzoni, STMicroelectronics Srl (Italy)
Catia Turco, STMicroelectronics Srl (Italy)
Umberto Iessi, STMicroelectronics Srl (Italy)
Marco Polli, KLA-Tencor (Italy)
Elyakim Kassel, KLA-Tencor (Israel)
Pavel Izikson, KLA-Tencor (Israel)
Yosef Avrahamov, KLA-Tencor (Israel)

Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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