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Proceedings Paper

EUV source collector
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Paper Abstract

A collector subsystem has been designed, built, and tested. The subsystem consists of a 320mm diameter ellipsoidal collector coated with a graded multilayer, mounting mechanics, thermal management capability, and a collector protection system. The EUV light emission can be collected with a solid angle of 1.6 sr. Collector substrates have been developed with the goal of offering both optical surface quality to support high multilayer mirror (MLM) reflectivity and material compatibility for long-term operation in the EUV source system. An interface-engineered MLM coating capable of maintaining high normal-incidence peak reflectivity at 13.5 nm during continuous operation at 400 °C has been developed. The thermal management of the system has been engineered and tested to maintain uniform substrate temperature during operation. Lastly, protection techniques have been developed to provide the collector with a long operational lifetime. Performance data for the entire subsystem are presented. The collector was installed in the source chamber of a laser-produced-plasma EUV source during system integration experiments using a tin droplet target. First results of the collected EUV output at the intermediate focus measured with a power meter and a fluorescence-converter-based imaging system are discussed.

Paper Details

Date Published: 24 March 2006
PDF: 9 pages
Proc. SPIE 6151, Emerging Lithographic Technologies X, 61513R (24 March 2006); doi: 10.1117/12.656462
Show Author Affiliations
Norbert R. Böwering, Cymer Inc. (United States)
Alex I. Ershov, Cymer Inc. (United States)
William F. Marx, Cymer Inc. (United States)
Oleh V. Khodykin, Cymer Inc. (United States)
Björn A. M. Hansson, Cymer Inc. (United States)
Ernesto Vargas L., Cymer Inc. (United States)
Juan A Chavez, Cymer Inc. (United States)
Igor V. Fomenkov, Cymer Inc. (United States)
David W. Myers, Cymer Inc. (United States)
David C. Brandt, Cymer Inc. (United States)

Published in SPIE Proceedings Vol. 6151:
Emerging Lithographic Technologies X
Michael J. Lercel, Editor(s)

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