Share Email Print

Proceedings Paper

Improving scanner productivity and control through innovative connectivity application
Author(s): Yuuki Ishii; Shinji Wakamoto; Atsuhiko Kato; Brad Eichelberger
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Overlay accuracy is a key issue in semiconductor manufacturing process. In the ITRS roadmap also, overlay budgets are being reduced at a rapid pace. Coupled with the decreasing technology node budget allowances, alternative processing techniques are also driving overlay budgets to shrink. To meet those requirements, high order modeling of overlay error is potentially an effective solution. One source of overlay error is distortion matching between exposure tools. Matching can be broken down in to 2 areas; grid (stage related) and distortion (lens related). By using high order modeling of grid and distortion matching, we have been able to show overlay improvement of up to 50%. KLA-Tencor and Nikon are planning to provide automatic feedback system of high order compensation to exposure tool directly from metrology results. This feedback system can provide adjustment of coefficients of grid and distortion for periodical maintenance. Automating this process will lead to not only improved overlay control but also improved exposure tool productivity.

Paper Details

Date Published: 24 March 2006
PDF: 7 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 615247 (24 March 2006); doi: 10.1117/12.656094
Show Author Affiliations
Yuuki Ishii, Nikon Corp. (Japan)
Shinji Wakamoto, Nikon Corp. (Japan)
Atsuhiko Kato, KLA-Tencor Corp. (United States)
Brad Eichelberger, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?