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Proceedings Paper

Application of super-diffraction lithography (SDL) for an actual device fabrication
Author(s): Shuji Nakao; Shinroku Maejima; Itaru Kanai; Akihiro Nakae; Junjiro Sakai; Koichiro Narimatsu; Kazuyuki Suko
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Paper Abstract

A novel RET, "Super Diffraction Lithography" (SDL), which enable 70 nm any pitch line by single exposure in KrF wavelength, has been studied in order to apply for an actual device pattern formation. In a previous work, the concept of SDL has been described with optical image calculations for 1-dimensional patterns and very superior performance has been proved. In this work, imaging characteristics and printing performance of typical 2-dimension patterns are investigated by optical image calculations and printing experiments to realize an application of SDL technique to fabrication of actual device patterns. As a result, very good performance is achieved for the typical 2-dimentional patterns such as line-end, tee-branch. Moreover, good performance is obtained for general SRAM patterns and standard cell of 65 nm node logic device with a little relaxation of design rule. In conclusion, by the application of SDL, 65 nm SoC patterns with a little relaxed design can be formed by single exposure process in KrF wavelength with a simple Atten-PSM. Then, huge cost reduction can be expected by application of SDL.

Paper Details

Date Published: 15 March 2006
PDF: 11 pages
Proc. SPIE 6154, Optical Microlithography XIX, 61542A (15 March 2006); doi: 10.1117/12.656043
Show Author Affiliations
Shuji Nakao, Renesas Technology Corp. (Japan)
Shinroku Maejima, Renesas Technology Corp. (Japan)
Itaru Kanai, Renesas Technology Corp. (Japan)
Akihiro Nakae, Renesas Technology Corp. (Japan)
Junjiro Sakai, Renesas Technology Corp. (Japan)
Koichiro Narimatsu, Renesas Technology Corp. (Japan)
Kazuyuki Suko, Renesas Technology Corp. (Japan)

Published in SPIE Proceedings Vol. 6154:
Optical Microlithography XIX
Donis G. Flagello, Editor(s)

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