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Proceedings Paper

Development of EUV resists in supercritical CO2 solutions using CO2 compatible salts (CCS)
Author(s): Mark Wagner; James De Young; Chris Harbinson
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Paper Abstract

Pattern collapse and line width roughness (LWR) are two issues expected to become increasingly important as feature sizes approach those expected from EUV lithography. The unique physical properties of supercritical CO2 (low viscosity, zero surface tension) may provide attractive solutions to these problems, but only if the limitations of CO2 (low polarity, low pH) can be overcome to give high contrast development of standard resists. This paper describes the use of novel CO2 compatible salts (CCS) in homogenous supercritical CO2 solutions to give highly effective reverse image development of a standard EUV resist. Results from a factorial DOE verify the robustness of this new process and indicate that temperature is the most important factor in determining development rate. The absence of surface tension in the homogenous CO2 solutions used for this development lead to substantially reduced pattern collapse and standing dense L/S features with aspect ratios >12. Development using CCS chemistry in CO2 is an anisotropic process, where CD of developed features can be controlled without affecting the resist film height. Plasticization of the amorphous resist polymer by CO2 during development contributes to the ~30% reduction in LWR for CCS samples versus standard TMAH development. The feasibility of scaling up CCS based development in CO2 from the small scale view cell into a 200 mm full wafer prototype tool has been demonstrated. A two-step process for resist development is proposed, along with a likely mechanism to account for the high level of contrast observed.

Paper Details

Date Published: 11 April 2006
PDF: 8 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 61531I (11 April 2006); doi: 10.1117/12.655880
Show Author Affiliations
Mark Wagner, Micell Integrated Systems (United States)
James De Young, Micell Integrated Systems (United States)
Chris Harbinson, Micell Integrated Systems (United States)

Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

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