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Proceedings Paper

Vapor deposited release layers for nanoimprint lithography
Author(s): Tong Zhang; Boris Kobrin; Mike Wanebo; Romek Nowak; Richard Yi; Jeff Chinn; Markus Bender; Andreas Fuchs; Martin Otto
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Paper Abstract

This paper presents the advantages of using a vapor deposited self-assembled monolayer (SAM) as a mold release layer for nano-imprint lithography. The release SAM was formed from a perfluorinated organo-silane precursor at room temperature in the gaseous state by a technique called Molecular Vapor Deposition (MVDTM). In contrast to a conventional coating from a liquid immersion sequence, the vapor deposition process forms a particulate free film resulting in a substantial reduction of surface defects. Another advantage of the vapor process is its excellent conformity onto the nanoscale topography of the mold. The self-assembling and self-limiting characteristics of the MVD process enables excellent CD control of the mold pattern. Pattern replication as small as 38nm features was achieved. Various other quantitative metrics of the MVD release layer are presented in this paper.

Paper Details

Date Published: 23 March 2006
PDF: 6 pages
Proc. SPIE 6151, Emerging Lithographic Technologies X, 615117 (23 March 2006); doi: 10.1117/12.654658
Show Author Affiliations
Tong Zhang, Applied MicroStructures, Inc. (United States)
Boris Kobrin, Applied MicroStructures, Inc. (United States)
Mike Wanebo, Applied MicroStructures, Inc. (United States)
Romek Nowak, Applied MicroStructures, Inc. (United States)
Richard Yi, Applied MicroStructures, Inc. (United States)
Jeff Chinn, Applied MicroStructures, Inc. (United States)
Markus Bender, AMO GmbH (Germany)
Andreas Fuchs, AMO GmbH (Germany)
Martin Otto, Institute of Semiconductor Electronics (Germany)

Published in SPIE Proceedings Vol. 6151:
Emerging Lithographic Technologies X
Michael J. Lercel, Editor(s)

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