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Proceedings Paper

High-density parallel optical interconnection for 10Tbps interconnection in high-speed memory test systems
Author(s): Toshiyuki Okayasu; Yusuke Hayase; Atsushi Ono; Daisuke Watanabe; Hajime Mori; Takehiko Nomura
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Paper Abstract

High-density parallel optical interconnection is introduced as a solution to solve transmission bottlenecks in memory test system. A protocol-free parallel optical module capable of transmitting from DC to 34.1 Gbps (4.267 Gbps × 8 ch) has been developed. Data transmission throughput density per unit volume of 19 Gbps/cc and random jitter of less than 3ps rms are achieved. And also, we will describe the manufacturing process, the module testing, and self-diagnosis for optical transmission system. Furthermore, high-density optical connector and high-density optical fiber cable suited for mechanical requirements of Memory Test System have been developed.

Paper Details

Date Published: 3 March 2006
PDF: 12 pages
Proc. SPIE 6124, Optoelectronic Integrated Circuits VIII, 61240M (3 March 2006); doi: 10.1117/12.650091
Show Author Affiliations
Toshiyuki Okayasu, Advantest Corp. (Japan)
Yusuke Hayase, Advantest Corp. (Japan)
Atsushi Ono, Advantest Corp. (Japan)
Daisuke Watanabe, Advantest Corp. (Japan)
Hajime Mori, The Furukawa Electric Co., Ltd. (Japan)
Takehiko Nomura, The Furukawa Electric Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 6124:
Optoelectronic Integrated Circuits VIII
Louay A. Eldada; El-Hang Lee, Editor(s)

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