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Proceedings Paper

Characterization and fabrication of MOEMS-based diffractive optical switching elements
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Paper Abstract

The use of miniaturized optical components for chip level communications is increasing rapidly. The possible applications include: optical switching, signal monitoring, I/O reconfiguration, and add/drop multiplexing. Micro-Opto-Electro-Mechanical Systems (MOEMS) based on customized IC fabrication processes are being used to assemble system-level architecture for integration into mainstream circuitry. MOEMS devices based on dynamic diffractive elements are currently investigated for both their signal routing capabilities and de-multiplexing properties. These characteristics are expected to increase the speed of optical data transfer. This paper focuses on the current status of the MOEMS research program for Free Space Optical inter-chip communication at the College of Nanoscale Science and Engineering, University at Albany- SUNY (CNSE) based on the MEMS Compound Grating (MCG) design. Operational characteristics of these MCG devices have been shown to operate at high voltages (>15V) compared to 5V levels prevalent in conventional integrated circuits. The specific goal of this work is to improve performance while minimizing power consumption. A design change that incorporates a higher capacitance and a lighter suspension system has been studied. A new fabrication process has been constructed utilizing Polyimide as a structural material. Fabrication steps have been optimized for best MCG device performance. Experimental results from both research tasks will be presented.

Paper Details

Date Published: 23 January 2006
PDF: 9 pages
Proc. SPIE 6114, MOEMS Display, Imaging, and Miniaturized Microsystems IV, 61140F (23 January 2006); doi: 10.1117/12.647806
Show Author Affiliations
Jaap Verheggen, SUNY, Univ. at Albany (United States)
Ganesh Panaman, SUNY, Univ. at Albany (United States)
James Castracane, SUNY, Univ. at Albany (United States)

Published in SPIE Proceedings Vol. 6114:
MOEMS Display, Imaging, and Miniaturized Microsystems IV
Hakan Ürey; David L. Dickensheets; Bishnu P. Gogoi, Editor(s)

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