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Proceedings Paper

Bit-interleaved optical bus for high-speed secure multiboard system
Author(s): Hai Bi; Jinho Choi; Wei Jiang; Xuliang Han; Jonathan Ellis; Robert Mays Jr.; Dale Griffiths; Ray T. Chen
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Paper Abstract

Optical backplane bus based on glass substrate with volume holographic gratings on top surface possesses a great ability to broadcast information. This feature is utilized to accomplish a bit-interleaved optical interconnect system. In this system, each daughter board sends only one bit per round and the bit pulses from different boards can cascade in a designed series when the transmitters are distributed in an appropriate manner. In this way, even slow electronic chips can be coordinated to generate an aggregate bandwidth up to 10Gbps, which is impossible to achieve with a multi-drop electrical bus. Besides the benefits of high data rate and low crosstalk, such a bit-interleaved architecture provides a secure data storage method. Each daughter board only stores a quarter bits of any byte, so that no single board has the entire information and security is enhanced. Alignment tolerance and power budget of the proposed optical interconnect system is theoretically calculated and experimentally verified. With collimating lenses, the packing density of transceivers is more than 4/cm2, and thus the signal density can be above 40Gbps/cm2/board. The insertion loss due to misalignment and beam divergence is measured to be approximately 3dB. The bit error rate (BER) of 10Gbps receivers with -12dBm sensitivity is estimated to be below 10-12.

Paper Details

Date Published: 28 February 2006
PDF: 9 pages
Proc. SPIE 6126, Photonics Packaging and Integration VI, 612604 (28 February 2006); doi: 10.1117/12.647043
Show Author Affiliations
Hai Bi, Univ. of Texas at Austin (United States)
Jinho Choi, Univ. of Texas at Austin (United States)
Wei Jiang, Univ. of Texas at Austin (United States)
Xuliang Han, Brewer Science Inc. (United States)
Jonathan Ellis, Advanced Communication Concepts, Inc. (United States)
Robert Mays Jr., R&D M Foundation (United States)
Dale Griffiths, Information Management Technology (United States)
Ray T. Chen, Univ. of Texas at Austin (United States)

Published in SPIE Proceedings Vol. 6126:
Photonics Packaging and Integration VI
Allen M. Earman; Ray T. Chen, Editor(s)

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