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Proceedings Paper

Applications of laser patterning to fabricate innovative thin-film silicon solar cells
Author(s): Wataru Shinohara; Masaki Shima; Shigeharu Taira; Kenji Uchihashi; Akira Terakawa
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Paper Abstract

In view of the need to obtain high-efficiency and low-cost photovoltaic power generation systems, the electrical series connection of multiple solar cells by laser patterning is a key issue for thin-film silicon solar cells. For a series connection with no thermal damage to the photovoltaic layers, a theoretical analysis of glass-side laser patterning, in which a laser beam is irradiated from the side of a glass substrate, and the optimization of the structure of the solar cells are conducted for a-Si:H/a-SiGe:H stacked solar cells deposited on glass substrates. As a result, an a-Si:H/a-SiGe:H module with both a large area (8,252 cm2) and a conversion efficiency of 11.2% is obtained. Then, to improve efficiency and to reduce cost, the minute structure of microcrystalline silicon (μ c-Si:H) and film-side laser patterning, in which a laser beam is irradiated from the side of the deposited film, are investigated for a-Si:H/μ c-Si:H stacked solar cells deposited on insulator/metal substrates. It is proved that the discontinuity of the doped and photovoltaic layer may cause a reduction in the path density of the leak current, and that this contributes to an improvement in the efficiency of the solar cells. Based on the developed structure, an initial efficiency of 12.6% is obtained in a small-size solar cell. An a-Si:H/μ c-Si:H module (Aperture area = 56.1cm2) with three segments has also been fabricated with an initial efficiency of 11.7% as a first try.

Paper Details

Date Published: 1 March 2006
PDF: 18 pages
Proc. SPIE 6107, Laser-based Micropackaging, 61070J (1 March 2006); doi: 10.1117/12.645611
Show Author Affiliations
Wataru Shinohara, SANYO Electric Co., Ltd. (Japan)
Masaki Shima, SANYO Electric Co., Ltd. (Japan)
Shigeharu Taira, SANYO Electric Co., Ltd. (Japan)
Kenji Uchihashi, SANYO Electric Co., Ltd. (Japan)
Akira Terakawa, SANYO Electric Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 6107:
Laser-based Micropackaging
Friedrich G. Bachmann; Willem Hoving; Yongfeng Lu; Kunihiko Washio, Editor(s)

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