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Proceedings Paper

Laser treatment of micro-components’ surface for improved tribological applications
Author(s): Kaidong Ye; Yeow-Whatt Goh; Cheow-Tong Cheng; Ching-Biing Yeo; Minghui Hong
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Paper Abstract

We are proposing a method and system to mount and treat the surface of a fabricated micro-component to improve its tribological performance. By irradiating an infrared laser under ambient conditions, the heat will penetrate the micro-component's surface, causing it to melt and flow to reduce the amount of irregularity. This method can create a desired surface finishing with good repeatability on selected regions of the micro-components. It can also work on surfaces of various material types as well as internal surfaces of thin planar or circular structure. By changing the laser power, the repetition rate and the scanning speed, the process can deal with surfaces of different roughness. The final surface roughness can be improved from micro-meter level to sub-100nm level. The laser treated micro-components have improved tribological performance as the friction is reduced; the abrasion, heat and noise are also reduced. The improvement can enhance the lifetime of the micro-component when used in micro rotating or sliding mechanism.

Paper Details

Date Published: 1 March 2006
PDF: 10 pages
Proc. SPIE 6106, Photon Processing in Microelectronics and Photonics V, 61060X (1 March 2006); doi: 10.1117/12.645602
Show Author Affiliations
Kaidong Ye, Data Storage Institute (Singapore)
Yeow-Whatt Goh, Data Storage Institute (Singapore)
Cheow-Tong Cheng, Sony Singapore Research Lab. (Singapore)
Ching-Biing Yeo, Sony Singapore Research Lab. (Singapore)
Minghui Hong, Data Storage Institute (Singapore)

Published in SPIE Proceedings Vol. 6106:
Photon Processing in Microelectronics and Photonics V
David B. Geohegan; Tatsuo Okada; Craig B. Arnold; Frank Träger; Jan J. Dubowski; Michel Meunier; Andrew S. Holmes, Editor(s)

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