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Proceedings Paper

Integrated waveguide micro-optic elements for 3D routing in board-level optical interconnects
Author(s): Alexei L. Glebov; Michael G. Lee; Shigenori Aoki; David Kudzuma; James Roman; Michael Peters; Lidu Huang; D. Steve Zhou; Kishio Yokouchi
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Paper Abstract

Planar waveguides and embedded microelements such as 45o vertical mirrors, lateral mirrors, bends, and microlenses comprise main building blocks of the waveguide-based optical printed circuit boards (PCB) for board-level optical interconnects (OI). These microelements enable a variety of three dimensional (3D) routing architectures which are required to support high density interconnects in optical boards. Optical polymers have proved to be the materials of choice for large-scale OI modules with propagation dimensions exceeding 100 mm. In order to meet the loss budget available for the integrated OI modules, the polymers are expected to have optical losses less than 0.05 dB/cm. Both channel and slab waveguides can be used to transmit the signals between the input and output ports. In the case of channel waveguides, the critical issues are the waveguide core shaping, propagation losses and ability to form various passive elements such as bends, crossings and reflective mirrors. In the case of slab waveguides, two dimensional waveguide microlenses have to be designed to collimate the light beams for propagation at longer distances with the controllable beam divergences. The 45o micromirrors can be used to couple the light signal in and out of the waveguiding layer and enable 3D routing of the optical signal in the waveguiding layers. In this work, we present the experimental and computational results on the development of different waveguide devices and microelements for the board level OI.

Paper Details

Date Published: 28 February 2006
PDF: 11 pages
Proc. SPIE 6126, Photonics Packaging and Integration VI, 61260N (28 February 2006); doi: 10.1117/12.644382
Show Author Affiliations
Alexei L. Glebov, Fujitsu Labs. of America (United States)
Michael G. Lee, Fujitsu Labs. of America (United States)
Shigenori Aoki, Fujitsu Labs. of America (United States)
David Kudzuma, Fujitsu Labs. of America (United States)
James Roman, Fujitsu Labs. of America (United States)
Michael Peters, Fujitsu Labs. of America (United States)
Lidu Huang, Fujitsu Labs. of America (United States)
D. Steve Zhou, Fujitsu Labs. of America (United States)
Kishio Yokouchi, Fujitsu Labs. of America (United States)

Published in SPIE Proceedings Vol. 6126:
Photonics Packaging and Integration VI
Allen M. Earman; Ray T. Chen, Editor(s)

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