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Proceedings Paper

On the out-of-plane deformation of freestanding micro-rings for tensile stress measurements
Author(s): Yang-Che Chen; Max Ti-Koung Hou; Rongshun Chen
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Paper Abstract

Micro-Rings have been widely used for measurement of residual tensile stress in thin films. This measurement approach provides a simple and convenient way to estimate the stress. However, it still lacks accuracy compared to other methods. In this study, we propose an alternative design, which arranges the central beam in the vertical orientation, shrinks the beam width, and widens the ring width to limit the undesired out-of-plane deformation of the ring portion and thus to improve the measurement results. The simulation result both has verified our design. The ring portion of conventional micro-ring is easily deformed in the out-of-plane direction when subjected to residual stress. In our design, such undesired out-of-plane buckling can be effectively prevented. Some suggestions for limiting the undesired out-of-plane deformation have been proposed. Following these suggestions, the more precise critical buckling length and the more accurate stress measurement will be obtained.

Paper Details

Date Published: 23 January 2006
PDF: 9 pages
Proc. SPIE 6109, Micromachining and Microfabrication Process Technology XI, 61090K (23 January 2006); doi: 10.1117/12.641154
Show Author Affiliations
Yang-Che Chen, National Tsing Hua Univ. (Taiwan)
Max Ti-Koung Hou, China Institute of Technology (Taiwan)
Rongshun Chen, National Tsing Hua Univ. (Taiwan)

Published in SPIE Proceedings Vol. 6109:
Micromachining and Microfabrication Process Technology XI
Mary-Ann Maher; Harold D. Stewart; Jung-Chih Chiao, Editor(s)

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