Share Email Print

Proceedings Paper

Micro/nano-scale integration of polymer optical wires and miniaturized photonic devices for optical printed circuit board (O-PCB) and VLSI photonic applications
Author(s): El-Hang Lee; S. G. Lee; B. H. O; S. G. Park; K. H. Kim; Y. K. Kwon; I.-J. Chin; Y. W. Choi; S. H. Song
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We describe our work on the micro/nano-scale design and integration of polymer optical waveguide wires and miniaturized optical devices for applications in an optical module system that we call "optical printed circuit board" (O-PCBs) and VLSI photonic integrated circuits. We fabricate the O-PCBs using planar arrays of polymer waveguides to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards. The VLSI photonic integrated circuits are designned to perform similar functions on a chip scale. We fabricate the polymer waveguides using thermal or ultra-violet (UV) embossing and imprinting technique. The optical boards which have 2-dimensional array of waveguides are attached to the electrical printed circuit board (E-PCBs) which carry the transmitter circuits and the receiver circuits of 2.5 Gbps or 10Gbps. In order to increase the efficiency of lightwave coupling between the lasers and the waveguide, we perform the alignment experiment between the laser and the waveguide via microlens and between the waveguide and the detector via microlens. The microlenses are fabricated by placing droppings of resins. Also, the 45-degree mirror to couple the light between the laser and the waveguide and the waveguide and the detector are fabricated by embossing technique to reduce the processing steps and for low-cost production purpose. For VLSI nano-scale photonic integration, we use photonic band-gap crystals and plasmonic waveguide structures. We discuss scientific issues and technological issues concerning the integration of micro- and nano-photonic devices and circuits.

Paper Details

Date Published: 5 December 2005
PDF: 8 pages
Proc. SPIE 6019, Passive Components and Fiber-based Devices II, 60191J (5 December 2005); doi: 10.1117/12.633968
Show Author Affiliations
El-Hang Lee, Inha Univ. (South Korea)
S. G. Lee, Inha Univ. (South Korea)
B. H. O, Inha Univ. (South Korea)
S. G. Park, Inha Univ. (South Korea)
K. H. Kim, Inha Univ. (South Korea)
Y. K. Kwon, Inha Univ. (South Korea)
I.-J. Chin, Inha Univ. (South Korea)
Y. W. Choi, Choong-Ang Univ. (South Korea)
S. H. Song, Inha Univ. (South Korea)
Han Yang Univ. (South Korea)

Published in SPIE Proceedings Vol. 6019:
Passive Components and Fiber-based Devices II
Yan Sun; Jianping Chen; Sang Bae Lee; Ian H. White, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?