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Proceedings Paper

Pattern fidelity performance from next-generation DUV laser lithography on 65nm masks and wafers
Author(s): Robert Kiefer; Peter Buck; Vishal Garg; Jason Hickethier; Curt Jackson; John Manfredo; Cris Morgante; Paul Allen; Michael White
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Paper Abstract

Currently, the ALTA 4300 generation Deep Ultra-Violet (DUV) Laser tool is capable of printing critical and semi-critical photomasks for the 130nm and 90nm IC technology nodes. With improved optical elements, an improved objective lens, and a higher bandwidth datapath the capability of the tool has been dramatically enhanced. Both the tools diffractive optic element (DOE) and acousto-optic modulator (AOM) have been refined. Additionally, the tools 33x, 0.8NA objective lens has been replaced with a 42x, 0.9NA objective lens. Finally, the tools datapath enhancement has allowed critical level write times to remain less than four hours. Quantitative results of these enhancements will be detailed through reporting of critical feature resolution limits, CD uniformity control, and pattern placement accuracy on mask. Performance will be shown from masks printed pre- and post- hardware upgrade. Experimental results will show actual improvements. In this paper details of the aerial image created when printing wafers with DUV Laser generated photomasks pre- and post-upgrade will be shown. Both 248nm and 193nm source printing with multiple illumination conditions will be discussed. Details of a print test comparison performed on photomasks from each tool configuration will be documented. The print test comparison will include process window characterization from each mask type. A study of the inspectability of the DUV Laser generated photomasks will also be highlighted.

Paper Details

Date Published: 4 November 2005
PDF: 12 pages
Proc. SPIE 5992, 25th Annual BACUS Symposium on Photomask Technology, 59920U (4 November 2005); doi: 10.1117/12.632227
Show Author Affiliations
Robert Kiefer, Toppan Photomasks, Inc. (United States)
Peter Buck, Toppan Photomasks, Inc. (United States)
Vishal Garg, Toppan Photomasks, Inc. (United States)
Jason Hickethier, Toppan Photomasks, Inc. (United States)
Curt Jackson, Toppan Photomasks, Inc. (United States)
John Manfredo, Toppan Photomasks, Inc. (United States)
Cris Morgante, Applied Materials, Inc. (United States)
Paul Allen, Applied Materials, Inc. (United States)
Michael White, Applied Materials, Inc. (United States)

Published in SPIE Proceedings Vol. 5992:
25th Annual BACUS Symposium on Photomask Technology
J. Tracy Weed; Patrick M. Martin, Editor(s)

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