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Proceedings Paper

Methodology to study the effect of moisture on refractive index of optical adhesive
Author(s): Shimin Lim; Anish Priyadarshi; Ranjan Rajoo; E. H. Wong; Subodh G. Mhaisalkar; Vaidyanathan Kripesh
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Paper Abstract

Optical adhesives (index-matching adhesive) serve a means of structural attachment as well as provide an optical path between connecting elements. Optical properties (such as refractive index and birefringence) of these polymeric adhesives are sensitive to environmental factors, which affects optical device performance. Thus this work attempts to develop a methodology to evaluate the impact of moisture on the refractive index of an index-matching adhesive. The return loss method was employed for monitoring the moisture dependence of refractive index of an acylate-based optical adhesive. The test was performed at a wavelength of 1.55 mm. At fixed time intervals, the return loss of the sample were measured with an optical time-domain reflectometer (OTDR) during moisture desorption. The amount of moisture present in the optical adhesive at different time was calculated with the help of desorption data. Thus, a correlation between time, the amount of moisture present and refractive index was obtained. At a constant temperature of 120°C, the refractive index of the adhesive decreases as moisture content increases. However, this decrease was more drastic for small amount of moisture absorbed at -1 x 10-4 (% moisture content)-1 compared to -7 x 10-6 (% moisture content)-1 when moisture absorption exceeds 10% of the dry sample weight.

Paper Details

Date Published: 12 April 2005
PDF: 6 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621989
Show Author Affiliations
Shimin Lim, Nanyang Technological Univ. (Singapore)
Anish Priyadarshi, Nanyang Technological Univ. (Singapore)
Institute of Microelectronics (Singapore)
Ranjan Rajoo, Institute of Microelectronics (Singapore)
E. H. Wong, Institute of Microelectronics (Singapore)
Subodh G. Mhaisalkar, Nanyang Technological Univ. (Singapore)
Vaidyanathan Kripesh, Institute of Microelectronics (Singapore)

Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

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