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Proceedings Paper

Simple optical characterisation for biomimetic micromachined silicon strain-sensing structure
Author(s): Dedy H. B. Wicaksono; Gregory Pandraud; Patrick J. French
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Paper Abstract

This paper presents an on-going work to develop micromachined silicon-based strain sensor inspired from the campaniform sensillum of insects. We present simple optical setup for the characterisation of a membrane-in-recess structure as an early stage in mimicking the natural sensor. The microstructure is a 500 nm-thick SiO2/SiN circular membrane, burried 13 μm from the surface of a 3x3 mm, 525 μm thick Si-chip. The chip was attached to a 45x10x0.525 mm Si beam. The simple optical characterisation setup is based on imaging the reflected laser beam from the biomimetic structure. Since an optical cavity between the membrane and the Si beams beneath was formed, ideal flat-parallel Fabry-Perot interferometer equation was applied to interpret the results semi-quantitatively. We obtained 2-D interference fringe pattern having 3 orders of maxima from the middle to the edge of the circular apperture, as a result of an initial internal membrane stress. The pattern changed non-linearly as we applied flexural strain from behind the beam up to 50 μm, most probably caused by nonlinear deflection of the membrane (i.e. the membrane did not deflect similarly as the beam beneath it). This phenomena might explain one of the strain-amplifying properties of this biomimetic strain sensing microstructure.

Paper Details

Date Published: 12 April 2005
PDF: 8 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621919
Show Author Affiliations
Dedy H. B. Wicaksono, Technische Univ. Delft (Netherlands)
Gregory Pandraud, Technische Univ. Delft (Netherlands)
Patrick J. French, Technische Univ. Delft (Netherlands)


Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

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