
Proceedings Paper
Laser interferometry method for measuring displacement field of crack tip of bimetal hot-dip specimenFormat | Member Price | Non-Member Price |
---|---|---|
$17.00 | $21.00 |
Paper Abstract
The U and V distortion fields at the interface of cracked zinc alloy ZAS35/carbon steel have been obtained by means of a laser moire interferometry. The optimum cast preheating temperature has been decided based on the experimentally determined shear strength. The microstructure of the interface of bimetal composite of zinc alloy ZAS35/carbon steel is analyzed and studied using X-ray diffraction and Scanning Electron Microscope (SEM). The phase component of the metallic interface bond of the alloy has been determined and the results of interface distribution of elements Fe and Zn have been obtained with dip coating at a temperature of 700°C. The above theory, the experimental technology and the results will be introduced and analyzed in this paper.
Paper Details
Date Published: 12 April 2005
PDF: 6 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621893
Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)
PDF: 6 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621893
Show Author Affiliations
Jiyong Chen, Shandong Univ. (China)
Anand Asundi, Nanyang Technological Univ. (Singapore)
Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)
© SPIE. Terms of Use
