The simulation of aircraft has often been performing by implementing finite element code on supercomputers. The reliability an accuracy of simulation depends mainly on the material model as well as on structural model used in calculations. Consequently, an accurate knowledge of mechanical behavior of materials under impact loading is essential for safety performance evaluation of structure. Impact tension tests on specimens for aircrafts and automotive structural applications are conduct by means of the split Hopkinson bar apparatus. Small specimens having diameter 4 mm are use in the test. Tensile stress-strain relations at strain rates of 10² s^-1 to over 10³ s^-1 are present and compared with those obtained at quasi-static strain rates. The limitations on the applicability of apparatus are also discusses. The other importance of the reference of strain, while studying void growth in elastic-viscoplastic material, is emphasized. In the present paper, a simplified plane-symmetrical two-dimensional finite element model for a SHPB with a plate specimen made of an elastic material is first established. The used of strain gage mounted at the specimens to be monitored strain during the course of impact test. Comparisons may then be made between the numerical predicted and experimentally observed of load and a specimen strain. This report also describes the apparatus and instrumentation, and also be discusses the advantages and limitations of experimental technique. Fractograph is taken by scanning electron microscope on the center of the specimens for judgment of the fracture mechanism and strain rates influences on the materials.

Date Published: 12 April 2005
PDF: 6 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621751

Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)