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Proceedings Paper

Optimized SU-8 UV-lithographical process for a Ka-band filter fabrication
Author(s): Peng Jin; Kyle Jiang; Jiubin Tan; M. J. Lancaster
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Paper Abstract

Rapidly expanding of millimeter wave communication has made Ka-band filter fabrication to gain more and more attention from the researcher. Described in this paper is a high quality UV-lithographic process for making high aspect ratio parts of a coaxial Ka band dual mode filter using an ultra-thick SU-8 photoresist layer, which has a potential application in LMDS systems. Due to the strict requirements on the perpendicular geometry of the filter parts, the microfabrication research work has been concentrated on modifying the SU-8 UV-lithographical process to improve the vertical angle of sidewalls and high aspect ratio. Based on the study of the photoactive property of ultra-thick SU-8 layers, an optimized prebake time has been found for obtaining the minimum UV absorption by SU-8. The optimization principle has been tested using a series of experiments of UV-lithography on different prebake times, and proved effective. An optimized SU-8 UV-lithographical process has been developed for the fabrication of thick layer filter structures. During the test fabrication, microstructures with aspect ratio as high as 40 have been produced in 1000 mm ultra-thick SU-8 layers using the standard UV-lithography equipment. The sidewall angles are controlled between 85~90 degrees. The high quality SU-8 structures will then be used as positive moulds for producing copper structures using electroforming process. The microfabication process presented in this paper suits the proposed filter well. It also reveals a good potential for volume production of high quality RF devices.

Paper Details

Date Published: 12 April 2005
PDF: 5 pages
Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621665
Show Author Affiliations
Peng Jin, Harbin Institute of Technology (China)
Kyle Jiang, Univ. of Birmingham (United Kingdom)
Jiubin Tan, Harbin Institute of Technology (China)
M. J. Lancaster, Univ. of Birmingham (United Kingdom)

Published in SPIE Proceedings Vol. 5852:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Chenggen Quan; Fook Siong Chau; Anand Asundi; Brian Stephen Wong; Chwee Teck Lim, Editor(s)

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