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Proceedings Paper

Print characterization of photomasks from next-generation deep-ultra-violet laser pattern generator
Author(s): Curt Jackson; Robert Kiefer; Peter Buck; David Mellenthin; John Manfredo; Vishal Garg; Jason Hickethier; Sarah Cohen; Cris Morgante; Paul C. Allen; Eric Christenson; Michael White
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Paper Abstract

Currently, the ALTA 4300 generation DUV Laser tool is capable of printing critical and semi-critical photomasks for the 130nm and 90nm IC technology nodes. With improved optical elements, an improved objective lens, and a higher bandwidth data-path the capability of the tool has been dramatically enhanced - culminating with the introduction of the ALTA 4700. Both the ALTA 4300 system’s diffractive optic element (DOE) and acousto-optic modulator (AOM) have been refined. Additionally, the ALTA 4300 system’s 33x, 0.8NA objective lens has been replaced with a 42x, 0.9NA objective lens. Finally, the tool’s data-path has been enhanced to maintain the ALTA system’s superior write time on critical mask layers. Quantitative results of these enhancements will be detailed through reporting of critical feature resolution limits, CD uniformity control, and pattern placement accuracy on mask. Performance will be shown from masks printed pre- and post- hardware upgrade. Experimental results will be compared with theoretical calculations that show expected and actual improvements. In this paper details of the aerial image created when printing wafers with DUV Laser generated photomasks pre- and post- upgrade will be shown. 193nm print results will be shown with multiple illumination conditions. Details of a print test comparison performed on photomasks from each tool configuration will be documented. The print test comparison will include process window characterization from each mask type.

Paper Details

Date Published: 28 June 2005
PDF: 11 pages
Proc. SPIE 5853, Photomask and Next-Generation Lithography Mask Technology XII, (28 June 2005); doi: 10.1117/12.617524
Show Author Affiliations
Curt Jackson, DuPont Photomasks, Inc. (United States)
Robert Kiefer, DuPont Photomasks, Inc. (United States)
Peter Buck, DuPont Photomasks, Inc. (United States)
David Mellenthin, DuPont Photomasks, Inc. (United States)
John Manfredo, DuPont Photomasks, Inc. (United States)
Vishal Garg, DuPont Photomasks, Inc. (United States)
Jason Hickethier, DuPont Photomasks, Inc. (United States)
Sarah Cohen, DuPont Photomasks, Inc. (United States)
Cris Morgante, Applied Materials Mask Products Division (United States)
Paul C. Allen, Applied Materials Mask Products Division (United States)
Eric Christenson, Applied Materials Mask Products Division (United States)
Michael White, Applied Materials Mask Products Division (United States)

Published in SPIE Proceedings Vol. 5853:
Photomask and Next-Generation Lithography Mask Technology XII
Masanori Komuro, Editor(s)

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