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Proceedings Paper

Post-treating techniques of porous silicon thin flm
Author(s): Ziqiang Zhu; Yongfu Long; Shaoqiang Chen; Xianwen Yu; Jianzhong Zhu
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Paper Abstract

An effective and simple novel technique for post-treating of PS films has been developed. The post treatment technique can avoid the cracking of PS films and enhance the stability, the surface smoothness and the mechanical intensity of the PS films, resulting in the expansion of application of the PS films.

Paper Details

Date Published: 8 December 2004
PDF: 4 pages
Proc. SPIE 5774, Fifth International Conference on Thin Film Physics and Applications, (8 December 2004); doi: 10.1117/12.608166
Show Author Affiliations
Ziqiang Zhu, East China Normal Univ. (China)
Yongfu Long, East China Normal Univ. (China)
Shaoqiang Chen, East China Normal Univ. (China)
Xianwen Yu, East China Normal Univ. (China)
Jianzhong Zhu, East China Normal Univ. (China)

Published in SPIE Proceedings Vol. 5774:
Fifth International Conference on Thin Film Physics and Applications
Junhao Chu; Zongsheng Lai; Lianwei Wang; Shaohui Xu, Editor(s)

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