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Proceedings Paper

Terra-Scope: a MEMS-based vertical seismic array
Author(s): Steven D. Glaser; Min Chen; Tom E Oberheim
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Paper Abstract

The Terra-Scope system is an affordable 4-D down-hole seismic monitoring system based on independent, microprocessor-controlled sensor Pods. The pods are nominally 50 mm in diameter, and about 120 mm long. They are expected to cost approximately $6000 each. An internal 16-bit, extremely low power MCU controls all aspects of instrumentation, eight programmable gain amplifiers, and local signal storage. Each pod measures 3-D acceleration, tilt, azimuth, temperature, and other parametric variables such as pore water pressure and pH. The following parameters are independently controllable at each pod: pre-trigger length, post-trigger length, trigger time stamp, sampling rate, trigger level, trigger parameters, non-volatile storage, and calibration and self-evaluation. Each Pod communicates over a standard digital bus (e.g. RS-485) through a complete web-based GUI interface, and has a power consumption of less than 400mW. Three-dimensional acceleration is measured by pure digital force-balance MEMS-based accelerometers. These accelerometers have a dynamic range of more than 115 dB and a frequency response from DC to 1000 Hz. The accelerometer chip uses a 5th order delta-sigma feedback loop to yield a noise floor of less than 30 ngrms/√Hz. Accelerations above 0.2 g are measured by a second set of MEMS-based accelerometers, giving a full 160 dB dynamic range. The prototype of the device is currently undergoing evaluation. The first array will be installed in the fall of 2005.

Paper Details

Date Published: 17 May 2005
PDF: 9 pages
Proc. SPIE 5765, Smart Structures and Materials 2005: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, (17 May 2005);
Show Author Affiliations
Steven D. Glaser, Univ. of California/Berkeley (United States)
Min Chen, Univ. of California/Berkeley (United States)
Tom E Oberheim, Univ. of California/Berkeley (United States)


Published in SPIE Proceedings Vol. 5765:
Smart Structures and Materials 2005: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems
Masayoshi Tomizuka, Editor(s)

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