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Proceedings Paper

Achieving miniature sensor systems via advanced packaging techniques
Author(s): David C. Hartup; Kevin Bobier; Jeffrey Demmin
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Paper Abstract

Demands for miniaturized networked sensors that can be deployed in large quantities dictate that the packages be small and cost effective. In order to accomplish these objectives, system developers generally apply advanced packaging techniques to proven systems. A partnership of Nova Engineering and Tessera begins with a baseline of Nova's Unattended Ground Sensors (UGS) technology and utilizes Tessera's three-dimensional (3D) Chip-Scale Packaging (CSP), Multi-Chip Packaging (MCP), and System-in-Package (SIP) innovations to enable novel methods for fabricating compact, vertically integrated sensors utilizing digital, RF, and micro-electromechanical systems (MEMS) devices. These technologies, applied to a variety of sensors and integrated radio architectures, enable diverse multi-modal sensing networks with wireless communication capabilities. Sensors including imaging, accelerometers, acoustical, inertial measurement units, and gas and pressure sensors can be utilized. The greatest challenge to high density, multi-modal sensor networks is the ability to test each component prior to integration, commonly called Known Good Die (KGD) testing. In addition, the mix of multi-sourcing and high technology magnifies the challenge of testing at the die level. Utilizing Tessera proprietary CSP, MCP, and SIP interconnection methods enables fully testable, low profile stacking to create multi-modal sensor radios with high yield.

Paper Details

Date Published: 27 May 2005
PDF: 8 pages
Proc. SPIE 5796, Unattended Ground Sensor Technologies and Applications VII, (27 May 2005); doi: 10.1117/12.603614
Show Author Affiliations
David C. Hartup, Nova Engineering (United States)
Kevin Bobier, Nova Engineering (United States)
Jeffrey Demmin, Tessera, Inc. (United States)

Published in SPIE Proceedings Vol. 5796:
Unattended Ground Sensor Technologies and Applications VII
Edward M. Carapezza, Editor(s)

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