Share Email Print

Proceedings Paper

New comprehensive metrics and methodology for metrology tool fleet matching
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Measurement matching among metrology tools to the level of the precision specifications in the ITRS is highly desirable. A quantitative measure of this matching should combine single tool precision, tool-to-tool nonlinearities, and tool-to-tool offsets. In this paper we introduce Tool (under test) Matching Precision (TMP) and Fleet Measurement Precision (FMP) as these "bottom-line" metrics. TMP measures a single tool matching performance against a similar benchmark tool, while FMP measures the performance of the entire fleet. The paper describes a technique to diagnose both the tool under test and the fleet of tools when these bottom-line metrics do not meet the required specifications. Additionally, the exercise of assessing the matching of two tools or a fleet of tools requires a methodology that identifies and constructs a set of desirable artifacts, handles measurement induced sample damage, and provides a set of diagnostic metrics to aid in identifying root causes of matching problems. The methodology can be used for many different metrology systems. This case study will revolve around simulated data and actual data acquired from CD SEMs.

Paper Details

Date Published: 10 May 2005
PDF: 11 pages
Proc. SPIE 5752, Metrology, Inspection, and Process Control for Microlithography XIX, (10 May 2005); doi: 10.1117/12.602330
Show Author Affiliations
Eric Solecky, IBM Microelectronics (United States)
Chas Archie, IBM Microelectronics (United States)
Bill Banke, IBM Microelectronics (United States)

Published in SPIE Proceedings Vol. 5752:
Metrology, Inspection, and Process Control for Microlithography XIX
Richard M. Silver, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?