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Proceedings Paper

A comprehensive comparison of spectral scatterometry hardware
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Paper Abstract

In this paper, three different types of spectral scatterometry hardware are compared using Timbre Technologies' Optical Digital Profiler (ODP) as a common software platform. The hardware under consideration includes a spectroscopic reflectometer (R), polarizing spectroscopic reflectometer (RP) and a spectroscopic ellipsometer (SE). Four advanced lithographic applications are evaluated-two from Spansion's 110-nm Flash memory technology line, and two from AMD's 90-nm logic process. ODP models are developed and optimized for each application and each type of hardware. Results include static and dynamic repeatability, throughput, correlation to incumbent metrology and correlation to cross-section. For each application, the authors also attempt to determine the level of model complexity supported by each hardware type, with special attention paid to the relative sensitivity of each system to changes in critical dimension (CD) and resist profile. The results generally indicate that the SE is the most sensitive hardware type while the R is the most stable. The RP occupies some form of middle ground on both counts. These generalizations are largely application dependent and clear differentiations do not always exist. Selecting the right spectral scatterometry hardware, therefore, is a function of one’s application complexity and control objectives.

Paper Details

Date Published: 10 May 2005
PDF: 14 pages
Proc. SPIE 5752, Metrology, Inspection, and Process Control for Microlithography XIX, (10 May 2005); doi: 10.1117/12.600783
Show Author Affiliations
Kevin Lensing, Advanced Micro Devices, Inc. (United States)
Broc Stirton, Advanced Micro Devices, Inc. (United States)
Brian Starnes, Spansion (United States)
Joseph Synoradzki, Advanced Micro Devices, Inc. (United States)
Bryan Swain, Timbre Technologies, Inc. (United States)
Lawrence Lane, Timbre Technologies, Inc. (United States)

Published in SPIE Proceedings Vol. 5752:
Metrology, Inspection, and Process Control for Microlithography XIX
Richard M. Silver, Editor(s)

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