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Proceedings Paper

Overlay process control for 16-Mb DRAM manufacturing
Author(s): Audrey C. Engelsberg; Debra Leach
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Paper Abstract

The tighter film and image size tolerances required for technologies at 0.5 micrometers and below make the control of overlay a critical process parameter. A modeling approach has been developed that is independent of the metrology tool and flexible enough to control overlay for a mix-and-match photolithography strategy. This paper describes the application of the methodologies developed and implemented to control overlay.

Paper Details

Date Published: 1 June 1992
PDF: 14 pages
Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); doi: 10.1117/12.59826
Show Author Affiliations
Audrey C. Engelsberg, IBM Corp. (United States)
Debra Leach, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 1673:
Integrated Circuit Metrology, Inspection, and Process Control VI
Michael T. Postek Jr., Editor(s)

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