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Proceedings Paper

Standard patterned wafer for performance evaluation of inspection tools
Author(s): Rivi Sherman; Ehud Tirosh; Gadi Neumann; David Alumot
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Paper Abstract

The defect detection capability of patterned wafer inspection tools is mainly determined by type and size of defects appearing on the wafer. However, detection capability depends not only on defect type and size but also on pattern density and defect location relative to the pattern. In particular, a dense pattern results in higher false alarm probability. Moreover, detection probability decreases with the distance between the defect and the neighboring pattern. The pattern density and defect location are not taken into account in the design of commonly used test wafers. This paper presents the design of a test-wafer aimed at meeting these essential properties. The wafer presented here, exhibiting variable density and spacing characteristics, has a potential of being used as an industry standard for evaluation of patterned wafer inspection tools.

Paper Details

Date Published: 1 June 1992
PDF: 8 pages
Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); doi: 10.1117/12.59811
Show Author Affiliations
Rivi Sherman, Orbot Instruments Ltd. (Israel)
Ehud Tirosh, Orbot Instruments Ltd. (Israel)
Gadi Neumann, Orbot Instruments Ltd. (Israel)
David Alumot, Orbot Instruments Ltd. (Israel)

Published in SPIE Proceedings Vol. 1673:
Integrated Circuit Metrology, Inspection, and Process Control VI
Michael T. Postek Jr., Editor(s)

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