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Proceedings Paper

Direct measurement of stepper mark detection accuracy on processed wafers
Author(s): Paolo Canestrari; Samuele Carrera; Giovanni Rivera
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Paper Abstract

A novel method to evaluate the accuracy of the stepper alignment system on processed substrates has been developed. The technique allows one to measure directly, with a limited number of wafers and high accuracy, just the contribution of the alignment system inaccuracy to final overlay. Applications of the method are under evaluation, especially in the optimization of the alignment systems of steppers. Experimental procedures and algorithms are provided and some examples of experimental results are shown.

Paper Details

Date Published: 1 June 1992
PDF: 12 pages
Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); doi: 10.1117/12.59804
Show Author Affiliations
Paolo Canestrari, SGS-Thomson Microelectronics (Italy)
Samuele Carrera, SGS-Thomson Microelectronics (Italy)
Giovanni Rivera, SGS-Thomson Microelectronics (Italy)

Published in SPIE Proceedings Vol. 1673:
Integrated Circuit Metrology, Inspection, and Process Control VI
Michael T. Postek Jr., Editor(s)

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