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Proceedings Paper

Dry development of resist patterns using RIE based on different electrical conductivity
Author(s): Joachim Bargon; Reinhard R. Baumann; Peter Boeker
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Paper Abstract

Patterns of different electrical conductivity can be converted into three-dimensional lithographic structures taking advantage of differential etching behavior of the electrically conducting versus the insulating areas under reactive ion etching conditions. Particularly suited substrates are intrinsically conducting polymers and composites thereof with common, insulating polymers. Initially, electrically conducting images are obtained via exposure of a photosensitive composite to visible of UV-light, followed by a subsequent (`dry') development step in the vapor of a suited monomer. The electrically conducting areas experience RIE-type etching and thus etch faster in an oxygen plasma than the insulating sections.

Paper Details

Date Published: 1 June 1992
PDF: 7 pages
Proc. SPIE 1672, Advances in Resist Technology and Processing IX, (1 June 1992); doi: 10.1117/12.59743
Show Author Affiliations
Joachim Bargon, Univ. of Bonn (Germany)
Reinhard R. Baumann, Technische Hochschule Leipzig (Germany)
Peter Boeker, Univ. of Bonn (Germany)

Published in SPIE Proceedings Vol. 1672:
Advances in Resist Technology and Processing IX
Anthony E. Novembre, Editor(s)

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