Share Email Print

Proceedings Paper

Evolution of MIMMI: a novel surface imaging resist based on metallic surface imaging of organic photoresists
Author(s): Kenneth J. Radigan; Silvia Liddicoat
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Depth of focus is known to decrease with short wavelengths of light or high numerical aperture lenses. With the advent of short wavelength ultraviolet sources (DUV - 248 nm, 213 nm & 193 nm), and high numerical aperture lenses (NA > .40), the depth of focus for imaging sub-micron features in single layer photoresist becomes an area of concern. Surface imaging resist (SIR), or top surface imaging (TSI) has been proposed as the solution to the diminishing depth of focus for lithography of single layer photoresists. The most commonly known form this technology has taken is the silylation of organic photoresists following exposure to an appropriate illuminating source. This technology has drawbacks in that the resulting silylated resist is not too much different chemically from many of the inorganic substrates that one wishes to pattern. This limits its applicability in use with fluorine containing plasmas. It also creates a film that is difficult to remove after the pattern transfer is accomplished. A developmental type of surface imaging system is currently being evaluated for its applicability as a photolithographical resist. MIMMITM (micro imaging with metal mask integration) uses an ultrathin metallic layer over conventionally applied and exposed photoresist. The film is shallowly developed and metallization is electrolessly applied to the remaining pattern. The metal pattern is further dry developed to complete its structure for image transfer. The metallized pattern is impervious to all commonly used plasma etch environments and is easily stripped in dilute acid and common organic solvents.

Paper Details

Date Published: 1 June 1992
PDF: 9 pages
Proc. SPIE 1672, Advances in Resist Technology and Processing IX, (1 June 1992); doi: 10.1117/12.59739
Show Author Affiliations
Kenneth J. Radigan, National Semiconductor Corp. (United States)
Silvia Liddicoat, National Semiconductor Corp. (United States)

Published in SPIE Proceedings Vol. 1672:
Advances in Resist Technology and Processing IX
Anthony E. Novembre, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?