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Proceedings Paper

Profile simulation of SU-8 thick film resist
Author(s): Yoshihisa Sensu; Atsushi Sekiguchi; Satoshi Mori; Nao Honda
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Paper Abstract

XP SU-8 3000 (hereinafter referred to as “SU-8”) thick-film resist is a chemically amplified negative resist based on epoxy resin. Here, we report on the profile simulation for this resist. Profile simulation is an important technique for planning experiments. Thus, there have been many reports on simulation techniques. In particular, many studies have been conducted on chemically amplified positive resists, as they are major resist materials used in the IC industry. However, there have been few simulation studies concerning chemically amplified negative resists. Under these circumstances, we have considered performing simulations on chemically amplified negative resist. The results of the simulation and the SEM observations are in good agreement. This study demonstrates that simulation is possible for a chemically amplified negative resist (SU-8).

Paper Details

Date Published: 4 May 2005
PDF: 16 pages
Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); doi: 10.1117/12.596856
Show Author Affiliations
Yoshihisa Sensu, Lithotech Japan Corp. (Japan)
Atsushi Sekiguchi, Lithotech Japan Corp. (Japan)
Satoshi Mori, Nippon Kayaku Co., Ltd. (Japan)
Nao Honda, Nippon Kayaku Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 5753:
Advances in Resist Technology and Processing XXII
John L. Sturtevant, Editor(s)

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