Share Email Print

Proceedings Paper

Micro-machining of silicon and glass with picosecond lasers
Author(s): Gediminas Raciukaitis; Marijus Brikas
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Results of microdrilling and cutting in silicon and glass with picosecond lasers are presented. Recent progress in the development of diode-pumped mode-locked (picosecond) lasers has increased interest in their industrial application, especially in microfabrication. Our experiments started from single-shot patterning and extended to cutting and drilling of complex shapes. They are directed at finding the right niche for these lasers. All-solid-state Nd-doped lasers of PL2200 series with high peak power were used. Pulse duration of 60 ps and pulse energy up to several mJ at 1 kHz repetition rate allowed to cover a wide energy density range above ablation threshold for processing. Limitations of processing windows for laser fabrication with picosecond pulses were established. The results are a consistent step in search of optimal regimes for crack-free processing with minimal deposit of material and high quality of ablated surface.

Paper Details

Date Published: 8 October 2004
PDF: 5 pages
Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); doi: 10.1117/12.596604
Show Author Affiliations
Gediminas Raciukaitis, EKSPLA Ltd. (Lithuania)
Institute of Physics (Lithuania)
Marijus Brikas, Institute of Physics (Lithuania)

Published in SPIE Proceedings Vol. 5662:
Fifth International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Henry Helvajian; Kazuyoshi Itoh; Kojiro F. Kobayashi; Andreas Ostendorf; Koji Sugioka, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?