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Proceedings Paper

Fabrication of micro-conductive patterns using laser ablation and selective electroless Ni-B plating
Author(s): Hyoung-Shik Kang; Hye-won Kim; Soon-Kug Hong; Jae Hoon Lee; Dong Sig Shin; Sung Goon Kang
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Paper Abstract

Micro-conductive patterns formed by selective electroless Ni-B plating process were fabricated to investigate the various distribution of the seed layer on insulating substrates. Selective distribution of the seed layer was forming through successive steps of laser ablation, activation treatment, mechanical polishing. A KrF Excimer laser (wavelength of 248 nm) ablation was carried out on the PMMA (Polymethymethacrylate), PET (Polyethylene Terephalate), PC (Polycarbonate) and PI (Polyimide substrates. The UV-vis spectrometer analysis showed that PMMA was a weaker absorber than other polymers at the wavelength of 248 nm. The geometrical shape of structure formed is affected by absorption coefficient. Surface morphology and characteristics after laser ablation and electroless plating is observed by Field Emission Scanning Electro Microscope (FE-SEM). As a increasing the depth of substrate patterned by laser ablation, plating was precise. Finally, we concluded this method to be suited for manufacturing micro-conductive patterns on insulating substrates without lithography.

Paper Details

Date Published: 8 October 2004
PDF: 4 pages
Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); doi: 10.1117/12.596556
Show Author Affiliations
Hyoung-Shik Kang, LG Electronics (South Korea)
Hye-won Kim, LG Electronics (South Korea)
Soon-Kug Hong, LG Electronics (South Korea)
Jae Hoon Lee, Korea Institute of Machinery & Materials (South Korea)
Dong Sig Shin, Korea Institute of Machinery & Materials (South Korea)
Sung Goon Kang, Hanyang Univ. (South Korea)

Published in SPIE Proceedings Vol. 5662:
Fifth International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Henry Helvajian; Kazuyoshi Itoh; Kojiro F. Kobayashi; Andreas Ostendorf; Koji Sugioka, Editor(s)

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